100x100x3mm Heatsink Cooling Thermal Conductive Gel Pads Uncut Mat BEA
USD 12.09 USD
Specifications
| Country Of Origin | Hong |
| Battery Included | As Describe |
| Brand | Unbranded |
| Chipset Manufacturer | As Describe |
| Chipset/GPU Model | As Describe |
| Color | As Describe |
| Colour | As Describe |
| Compatible Brand | As Describe |
| Compatible Model | As Describe |
| Connectivity | As Describe |
| Density | 2.35 |
| Department | As Describe |
| Fire Resistance | UL94 V0 |
| Form Factor | As Describe |
| Hardness | 13c - 50c |
| Internet Connectivity | As Describe |
| Material | As Describe |
| Memory Card(s) Supported | As Describe |
| Model | As Describe |
| Permittivity | 260±18 |
| Processor | As Describe |
| Screen Size | As Describe |
| Storage Capacity | As Describe |
| Style | As Describe |
| Technologie De Pile/batterie | As Describe |
| Temperature | 40°C - 220°C |
| Tensile Strength | (PSI)≥35 |
| Thermal Conductivity | 5.0 |
| Type | As Describe |
| Voltage | As Describe |
| UPC | 7707002059946 |
High temperature resistance, low temperature, good thermal conductivity. Thermal Conductivity: 5.0. Material: Gel. 1 x CPU Thermal Pad. Free installation,maximum heat conduction and increased cooling.