Dynatron Top Motor DF128025BM Dual Ball Bearing Fan ~ 80mm ~ 12 VDC
Part #: DF128025BM. Dynatron Top Motor Dual Ball Bearing Fan. Specs: 80mm ~ 12 VDC. Includes installation screws.
Read MorePart #: DF128025BM. Dynatron Top Motor Dual Ball Bearing Fan. Specs: 80mm ~ 12 VDC. Includes installation screws.
Read MoreDynatron’s J25 is a 4U CPU heatsink and blower for AMD’s Socket SP7 “Venice” processors. Made with copper heat spreader embedded aluminum vapor chamber base, aluminum fins, and heat pipes with a blower fan to cool up to 600W TDP at 30°C.
Read MoreWith its powerful airflow and low noise operation, the A47 ensures stable temperatures without compromising on acoustics. DYNATRON A47. TDP Support CPU Power up to 170 Watts Heat Dissipation. Active Cooler for 2U Server & Up.
Read MoreDynatron Q5 Professional CPU Heatsink w/ PWM Fan for LGA1851 and LGA1700.
Read MoreGeneral Description Recommend for Intel Alder Lake S Processor, Socket LGA 1700. 60 x 60 x 25 mm Fan with PWM function, Copper Base & Aluminum Fins with Heatpipes Embedded. Active Cooler for 2U Server and Up. Supports CPU Power up to 125 Watts Heat Dissipation. Key Features Supports Intel Alder Lake-S Socket LGA 1700 Copper Base, Aluminum Fins with Heatpipes Supports up to 125W TDP Pre-applied Shin-Etsu 7762 Thermal Grease Dimensions: 3.6″ x 3.3″ x 2.6″ Technical Specifications Manufacturer Dynatron Product ID Q5 CPU Support Supports Intel Alder Lake-S Socket LGA 1700 Up to 125W TDP Connection 4 Pin (PWM) Voltage 12V Speed At Duty Cycle 20%: 1600 RPM At Duty Cycle 50%: 4000 RPM At Duty Cycle 100%: 8000 RPM Performance At Duty Cycle 20%: 9.28 CFM At Duty Cycle 50%: 23.21 CFM At Duty Cycle 100%: 46.41 CFM Volume At Duty Cycle 20%: 18 dBA At Duty Cycle 50%: 37.89 dBA At Duty Cycle 100%: 52.94 dBA Dimensions 90.7 x 85.0 x 65.1mm 3.6″ x 3.3″ x 2.6″ (in inches, approximate) Fan Dimensions 60 x 60 x 25 mm 2.36″ x2.36″ x 0.98″ (in inches) Weight 515.2 g 1.14 lbs Features Shin-Etsu 7762 Thermal Grease
Read MoreDynatron U15 aluminum heatsink with copper heatpipes. Pre-printed Shin Etsu thermal paste. Manufacturer Dynatron. Product ID U15. Aluminum Heatsink with Copper Heatpipes. Supports AMD AM5/AM4. Supports up to 146W for AMD.
Read MoreRecommended for AMD® Ryzen Threadripper Processor, Socket sWRX8, sTRX4, TR4, and AMD® Epyc Processor Socket SP3, All-in-one Liquid Cooler for 1U Server, Three 4 cm cooling fans with 4-pin PWM Connector, Support CPU Overclocking Power Mode up to 280 Watts Heat Dissipation CPU SupportAMD® CPU SocketSocket sWRX8/sTRX4/TR4/SP3 Solution1U Server Fan Dimension40.0 x 40.0 x 28.0 mmSpeedAt Duty Cycle 0~20%: 2000 ± 10% RPMAt Duty Cycle 50%: 10000 ± 10% RPMAt Duty Cycle 100%: 18000 ±10% RPM Bearing2 Ball Bearing Rated Voltage12V PowerAt Duty Cycle 0~20%: 2.40 WAt Duty Cycle 50%: 7.20 WAt Duty Cycle 100%: 15.60 W Air FlowAt Duty Cycle 0~20%: 2.944 CFMAt Duty Cycle 50%: 14.72 CFMAt Duty Cycle 100%: 30.6 CFM Noise LevelAt Duty Cycle 0~20%: 16.00 dBAAt Duty Cycle 50%: 44.24 dBAAt Duty Cycle 100%: 57.00 dBA Air PressureAt Duty Cycle 0~20%: 0.61 mm-H2OAt Duty Cycle 50%: 15.12 mm-H2OAt Duty Cycle 100%: 49.0 mm-H2O Lead Wire Pin OutPin1- (-)Pin2- (+) Pin3- (Tachometer output) Pin4- (PWM Control) Water Pump Stand-alone Water Pump in flow rate 1.7 Liter Per Minute
Read MoreDynatron R24 CPU Fan Heatsink for Intel LGA 2011 Socket R 2U Ball Bearing
Read MoreDynatron R18 1U Rackmount LGA 2011 CPU Cooler for Intel® Xeon® Processors Dynatron® R18: 1U LGA 2011 Active CPU Cooler For Intel® Xeon® Processors Active 1U rackmount CPU cooler from Dynatron® for Intel® LGA 2011 (Socket R) Sandy Bridge server processors. The R18 1U CPU cooler is comprised of two components. The copper heatsink with skived-fins provide optimal heat transfer and dissipation and is aligned (fin direction parallel to airflow) to the 80mm blower on top. Using this design, the R18 is able to provide cooling for processors with a maximum TDP of 95W in a compact 1U design. Thermal compound is pre-printed with Shin-Etsu G751; no additional thermal compound is required. Noteable features include: Solid copper heatsink with skived-fins Dual-ball bearing blower for durability Supports 1U+ Pre-printed thermal compound RoHS Compliance Dynatron® R18: 1U LGA 2011 Active CPU Cooler For Intel® Xeon® Processors Manufacturer’s P/N: R18 Dimensions: 90 x 90 x 27.7 mm 3.54″ x 3.54″ x 1.1″ (in inches) Blower Size: 80mm x 80mm x 15mm CPU Support: LGA 2011 (Socket R) Sandy Bridge-E Intel® Core™ i7, Xeon® E5 and other LGA 2011 processors 95W TDP MAX Features: Shin-Etsu G751 Thermal Compound (pre-printed) Rated Voltage: 12V Input Power: At Duty Cycle 20%: 0.6 W At Duty Cycle 50%: 3.84 W At Duty Cycle 100%: 14.4 W Speed: At Duty Cycle 20%: 1000 RPM At Duty Cycle 50%: 3500 RPM At Duty Cycle 100%: 6000 RPM Static Pressure: At Duty Cycle 20%: 2.27 mm-H2O At Duty Cycle 50%: 18.56 mm-H2O At Duty Cycle 100%: 54.5 mm-H2O Maximum Airflow: At Duty Cycle 20%: 6.5 CFM At Duty Cycle 50%: 11.2 CFM At Duty Cycle 100%: 19.1 CFM Noise Level: At Duty Cycle 20%: 21.5 dBA At Duty Cycle 50%: 43.0 dBA At Duty Cycle 100%: 55.8 dBA Connector : 4-pin PWM International Shipping Details Import taxes, customs duties and all associated fees during importation will be the responsibility of the purchaser. Please note that USPS does NOT guarantee delivery dates for their international services. Therefore, we cannot provide a guaranteed delivery date if you choose USPS international mailing services. USPS Priority Mail International has an estimated delivery transit time of 6-11 business days. USPS Express Mail International has an estimated delivery transit time of 3-5 business days. In addition to the estimated delivery time, you should expect additional delay due to customs control and the processing by the local postal authority in your country. No transit-time estimates are available for USPS First Class Mail International packages and no tracking information is available. If you have any time constraints, please ship Express Mail service. If you require tracking information and insurance, select Express Mail service.
Read MoreManufacturer Dynatron. This state-of-the-art PC fan integrates high-definition holographic projection, allowing you to display custom 3D models, images, and videos on your fan blades. Utilizing the Holo APP via WiFi, users can effortlessly upload and manage content, creating a personalized and dynamic PC setup.
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